Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology

Feng Feng; Elisa D. Mekler

doi:10.1145/3689050.3704419

Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology

Play, Culture, and AI

University of Bristol

Research output: Conference Article in Proceeding or Book/Report chapter › Article in proceedings › Research › peer-review

Abstract

A "warm" smile? A "cold" rage? Thermal and emotional experiences are often tightly connected. In recent years HCI has investigated opportunities for thermal technologies to enrich user experience. However, our vocabulary for these experiences has remained limited and inexpressive: "hot", "cold", "warm", "cool". This limits our ability to describe and conceptualise experience, and impedes the exploration of design features for thermal and affective interaction. Our pictorial offers resources to enrich language and clarify the design space for thermal and affective technologies. We expand a recently developed theoretical framework based on Chinese classical poetry to present six lenses on thermal and affective experience. The pictorial also functions as a deck of design cards with a design exemplar. Together these resources can help researchers and designers conceptualise thermal experience, explore parameters for experiential design, and design technologies for rich thermal and affective experience.

Original language	English
Title of host publication	TEI '25: Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction
Number of pages	13
Publisher	Association for Computing Machinery
Publication date	4 Mar 2025
Pages	1-13
ISBN (Print)	9798400711978
ISBN (Electronic)	979-8-4007-1197
DOIs	https://doi.org/10.1145/3689050.3704419
Publication status	Published - 4 Mar 2025
Event	Conference on Tangible, Embedded, and Embodied Interaction - https://dl.acm.org/doi/proceedings/10.1145/3689050, Colorado , France Duration: 4 Mar 2025 → 7 Mar 2025 Conference number: 19th

Conference

Conference	Conference on Tangible, Embedded, and Embodied Interaction
Number	19th
Location	https://dl.acm.org/doi/proceedings/10.1145/3689050
Country/Territory	France
City	Colorado
Period	04/03/2025 → 07/03/2025

Keywords

Thermal interaction
Affect
Emotion
Experiential quality
Design cards
Design principle
Cross-culture
Chinese poetry

Access to Document

10.1145/3689050.3704419

Theorycraft: Bridging the Games Research-Practice Gap through Theory Translation
Mekler, E. (PI), Vornhagen, J. B. (CoI), Piitulainen, R. (CoI), Bennett, D. (CoI), Feng, F. (CoI), Robinson, R. (CoI), Wegmann, D. J. (CoI), Elvig, M. L. (Collaborator) & Murphy, D. J. (Collaborator)
European Commission
01/09/2022 → 31/08/2027
Project: Research

Cite this

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title = "Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology",

abstract = "A {"}warm{"} smile? A {"}cold{"} rage? Thermal and emotional experiences are often tightly connected. In recent years HCI has investigated opportunities for thermal technologies to enrich user experience. However, our vocabulary for these experiences has remained limited and inexpressive: {"}hot{"}, {"}cold{"}, {"}warm{"}, {"}cool{"}. This limits our ability to describe and conceptualise experience, and impedes the exploration of design features for thermal and affective interaction. Our pictorial offers resources to enrich language and clarify the design space for thermal and affective technologies. We expand a recently developed theoretical framework based on Chinese classical poetry to present six lenses on thermal and affective experience. The pictorial also functions as a deck of design cards with a design exemplar. Together these resources can help researchers and designers conceptualise thermal experience, explore parameters for experiential design, and design technologies for rich thermal and affective experience.",

keywords = "Chinese poetry, Thermal interaction, affect, emotion, cross-culture, design cards, design principle, experiential quality, Thermal interaction, Affect, Emotion, Experiential quality, Design cards, Design principle, Cross-culture, Chinese poetry",

author = "Feng Feng and Mekler, \{Elisa D.\}",

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doi = "10.1145/3689050.3704419",

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booktitle = "TEI '25: Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction",

publisher = "Association for Computing Machinery",

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note = " Conference on Tangible, Embedded, and Embodied Interaction ; Conference date: 04-03-2025 Through 07-03-2025",

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Feng, F & Mekler, ED 2025, Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology. in TEI '25: Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, pp. 1-13, Conference on Tangible, Embedded, and Embodied Interaction, Colorado , France, 04/03/2025. https://doi.org/10.1145/3689050.3704419

Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology. / Feng, Feng ; Mekler, Elisa D.
TEI '25: Proceedings of the Nineteenth International Conference on Tangible, Embedded, and Embodied Interaction. Association for Computing Machinery, 2025. p. 1-13.

Research output: Conference Article in Proceeding or Book/Report chapter › Article in proceedings › Research › peer-review

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ER -

Thermal Cards: From Classical Chinese Poetry to Designerly Lenses on Thermal-Affective Technology

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Theorycraft: Bridging the Games Research-Practice Gap through Theory Translation

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