A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia; Jochen Hiller; Kasper Støy; Hod Lipson

A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia, Jochen Hiller, Kasper Støy, Hod Lipson

Computer Science

Research output: Journal Article or Conference Article in Journal › Journal article › Research

Abstract

We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

Original language	Undefined/Unknown
Journal	I E E E Transactions on Robotics
Volume	27
Issue number	5
Pages (from-to)	876-890
Number of pages	15
ISSN	1552-3098
Publication status	Published - 9 Jun 2011

Keywords

Cellular and modular robots
mechanism design
vacuum connectors

Cite this

@article{3b3af7bcdaa140b0a225956b9fe0b08f,

title = "A vacuum-based bonding mechanism for modular robotics",

abstract = "We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.",

keywords = "Cellular and modular robots, mechanism design, vacuum connectors, Cellular and modular robots, mechanism design, vacuum connectors",

author = "Garcia, {Ricardo Franco Mendoza} and Jochen Hiller and Kasper St{\o}y and Hod Lipson",

year = "2011",

month = jun,

day = "9",

language = "Udefineret/Ukendt",

volume = "27",

pages = "876--890",

journal = "I E E E Transactions on Robotics",

issn = "1552-3098",

publisher = "Institute of Electrical and Electronics Engineers",

number = "5",

}

TY - JOUR

T1 - A vacuum-based bonding mechanism for modular robotics

AU - Garcia, Ricardo Franco Mendoza

AU - Hiller, Jochen

AU - Støy, Kasper

AU - Lipson, Hod

PY - 2011/6/9

Y1 - 2011/6/9

N2 - We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

AB - We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.

KW - Cellular and modular robots

KW - mechanism design

KW - vacuum connectors

KW - Cellular and modular robots

KW - mechanism design

KW - vacuum connectors

M3 - Tidsskriftartikel

SN - 1552-3098

VL - 27

SP - 876

EP - 890

JO - I E E E Transactions on Robotics

JF - I E E E Transactions on Robotics

IS - 5

ER -