A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia, Jochen Hiller, Kasper Støy, Hod Lipson

    Research output: Journal Article or Conference Article in JournalJournal articleResearch

    Abstract

    We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.
    Original languageUndefined/Unknown
    JournalI E E E Transactions on Robotics
    Volume27
    Issue number5
    Pages (from-to)876-890
    Number of pages15
    ISSN1552-3098
    Publication statusPublished - 9 Jun 2011

    Keywords

    • Cellular and modular robots
    • mechanism design
    • vacuum connectors

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