A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia, Jochen Hiller, Kasper Støy, Hod Lipson

Publikation: Artikel i tidsskrift og konference artikel i tidsskriftTidsskriftartikelForskning

Abstract

We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.
OriginalsprogUdefineret/Ukendt
TidsskriftI E E E Transactions on Robotics
Vol/bind27
Udgave nummer5
Sider (fra-til)876-890
Antal sider15
ISSN1552-3098
StatusUdgivet - 9 jun. 2011

Emneord

  • Cellular and modular robots
  • mechanism design
  • vacuum connectors

Citationsformater