A vacuum-based bonding mechanism for modular robotics

Ricardo Franco Mendoza Garcia, Jochen Hiller, Kasper Støy, Hod Lipson

    Publikation: Artikel i tidsskrift og konference artikel i tidsskriftTidsskriftartikelForskning

    Abstract

    We explore vacuum as bonding force for modular robotics. Vacuubes are a set of modules that propagate vacuum across their interfaces in order to generate adhesive forces to form and hold structures. We use analog circuits to simulate vacuum transients and understand critical design parameters and then validate these insights in experiments. A 49-module structure that employs vacuum bonding is demonstrated. We conclude that vacuum offers a relatively strong, simple, reliable, and power-efficient connection principle.
    OriginalsprogUdefineret/Ukendt
    TidsskriftI E E E Transactions on Robotics
    Vol/bind27
    Udgave nummer5
    Sider (fra-til)876-890
    Antal sider15
    ISSN1552-3098
    StatusUdgivet - 9 jun. 2011

    Emneord

    • Cellular and modular robots
    • mechanism design
    • vacuum connectors

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